Equipment
![]() ![]() SMT (Surface Mount Tech)FeaturesNormal Process and lead-free process. ![]() ![]() DIP FeaturesPTH: Dual wave soldering(Lead-free-process) and multi-point soldering. F/G(Finished Product):Final Assembly, Packing, Test![]() ![]() ![]() Manufacturing ProductVarious electronic products, including SMT insertions, assembly, test, maintenance, and fabrication. ![]() ![]() ![]() The Equipment FeaturesSI-E1100 is a compact size machine with high-speed and good-performance chip mounter. It employs a newly developed super-compact planet head to achieve the highest speed and performing rating in its class. These attributes are accmpanied by high-quality placement capabilities supporting part thickness inspection and selectable reflective/transmission part recongnition. Together, they ensure easy high-density mounting operation andselectable reflective/transmission part recongnition. Together, they wnsure easy high-density mounting operation. With newly risen techniques of the wrld, the smallest rotary head(Planet Head) can offer industry high-class performance. It features rotary indexer-equivalent precision realized by controlling the planet gears with a full closed rotary servo. Bi-directional head rotation provides optimum head control, yielding a significant reduction of time loss in head movement. ![]() ![]() |